Continued scaling of integrated circuits to smaller dimensions is still a viable way to increase compute power, achieve higher memory cell density, or reduce power consumption. These days, chip makers ...
SAN JOSE — Ultratech Stepper Inc. today rolled out a new exposure tool, called the Star 100, which is aimed at serving lithography process steps with device feature sizes above 0.8 micron. The new ...
Intel Foundry has become the first chipmaker to manufacture and ship a high-volume logic ...
Higher density fan-out packages are moving toward more complex structures with finer routing layers, all of which requires more capable lithography equipment and other tools. The latest high-density ...
Researchers review AI-powered inverse lithography, showing how deep learning boosts chip patterning precision and efficiency while facing scaling challenges. Computational lithography optimizes the ...