System-in-package (SiP) and other advanced packaging technologies are putting more components together in tighter spaces than previously seen. Often these packages are contained in a module, which is ...

Even a small array consisting of 100 elements has thousands of individual components that require perhaps 25,000 measurements per module for an eye-watering grand ...

Whether you’re testing conventional electronics or advanced embedded electronic systems, test processes are pretty similar, explains Hiroshi Goto, high-speed & optical product manager and senior ...

The idea of unit testing has been around for many years. "Test early, test often" is a mantra that concerns unit testing as well. However, in practice, not many software projects have the luxury of ...